Advanced Optimization and Empirical Study of Heat Sink Efficiency for Superior Heat Transfer

International Journal of Mechanical Engineering
© 2025 by SSRG - IJME Journal
Volume 12 Issue 9
Year of Publication : 2025
Authors : Amol More, Sanjeev Kumar, Sandeep Kore
pdf
How to Cite?

Amol More, Sanjeev Kumar, Sandeep Kore, "Advanced Optimization and Empirical Study of Heat Sink Efficiency for Superior Heat Transfer," SSRG International Journal of Mechanical Engineering, vol. 12,  no. 9, pp. 78-90, 2025. Crossref, https://doi.org/10.14445/23488360/IJME-V12I9P108

Abstract:

The present research explores the advanced methods to enhance the heat dissipation behaviour of a pin fin heat sink for electronic cooling. Commonly adopted designs do not provide sufficient cooling performance under high power load, and the interaction between fin structure/material/fans has not been well understood. In order to resolve this, five different heat sink models (Plate Fin Heat Sink – PFHS, Circular Pin Fin Heat Sink – CPFHS, Polar pin fin C condition gives the minimum value of thermal resistance and maximum values of Q for a change in heated mode) been performed with studies it is observed that PCMPFHS compared with remaining materials presents the lowest temperature rise. The results indicated that pin fin fins were more effective compared to plate heater sinks, with forced convection being the most favorable. Of the configurations tested, the perforated and PCM-augmented models featured promising scaling capacity for thermal performance. An optimization formulation was further created to trade thermal performance against cost and ease of manufacturing. These results can help guide the development of next-generation heat sinks for small, high-power electronics.

Keywords:

Efficient heat-transfer, Fluid dynamics, Thermal behavior, Wall shear stress, Pin fin heat sink.

References:

[1] Ashish Dixit, Rajesh Maithani, and Sachin Sharma, “Enhancing Electronic System Cooling: Exploring Minichannel Heat Sink Solutions,” Journal of Thermal Analysis and Calorimetry, vol. 150, pp. 5357-5407, 2025.
[CrossRef] [Google Scholar] [Publisher Link]
[2] Rilwan Kayode Apalowo et al., “Investigating the Impacts of Heat Sink Design Parameters on Heat Dissipation Performance of Semiconductor Packages,” International Journal of Thermal Sciences, vol. 208, 2025.
[CrossRef] [Google Scholar] [Publisher Link]
[3] Xiong Zhao et al., “Microfluidic One-Step and Large-Scale Production of Silica and Titania Nanofluids toward Phase-Change Heat Transfer Intensification of Power Electronic Devices,” Chemical Engineering Journal, vol. 503, 2025.
[CrossRef] [Google Scholar] [Publisher Link]
[4] Hussam Sadique, Qasim Murtaza, and Samsher, “Heat Transfer Augmentation in Microchannel Heat Sink Using Secondary Flows: A Review,” International Journal of Heat and Mass Transfer, vol. 194, 2022.
[CrossRef] [Google Scholar] [Publisher Link]
[5] Qinghua Wang et al., “Numerical Simulation of Fluid and Heat Transfer Characteristics of Microchannel Heat Sink with Fan-Shaped Grooves and Triangular Truncated Ribs,” International Communications in Heat and Mass Transfer, vol. 155, 2024. [CrossRef] [Google Scholar] [Publisher Link]
[6] Rimpy Singh, “Numerical Simulation and Optimization of Fin Configurations for Enhanced Heat Sink Performance in Aluminum and Copper Materials,” Mechanical and Aerospace Engineering Theses, pp. 1-57, 2024.
[Google Scholar] [Publisher Link]
[7] S.R. Akhil Krishnan et al., “Experimental and Numerical Investigation on the Performance of Binary Solid-Solid Phase Change Materials with Integrated Heat Pipe and Aluminium Foam Based Heat Sink for Thermal Management of Electronic Systems,” International Journal of Thermal Sciences, vol. 208, 2025.
[CrossRef] [Google Scholar] [Publisher Link]
[8] C.M. Ramesha et al., “Enhancing Thermal Conductivity of Aluminium 6063 Alloy by Adding Titanium for Advanced Heat Sink Applications,” Innovations in Electronic Materials: Advancing Technology for a Sustainable Future, pp. 377-384, 2025. [CrossRef] [Google Scholar] [Publisher Link]
[9] Ahmad Ali Awais, and Man-Hoe Kim, “Experimental and Numerical Study on the Performance of a Minichannel Heat Sink with Different Header Geometries Using Nanofluids,” Applied Thermal Engineering, vol. 171, 2020.
[CrossRef] [Google Scholar] [Publisher Link]
[10] Zannatul Mehjabeen et al., “Numerical Study of Arrowhead, Hexagonal, and Concave Shaped-Elliptical Perforated Plate Fin Heatsinks to Improve the Hydrothermal Performance Factor,” International Journal of Thermal Sciences, vol. 207, 2025. [CrossRef] [Google Scholar] [Publisher Link]
[11] Ayushman Srivastav, Rajesh Maithani, and Sachin Sharma, “Innovative Impinging Jet Methods for Performance Enhancement: A Review,” Journal of Thermal Analysis and Calorimetry, vol. 149, pp. 13581-13627, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[12] Mohammad Harris et al., “Heat Transfer Optimisation using Novel Biomorphic Pin-Fin Heat Sinks: An Integrated Approach via Design for Manufacturing, Numerical Simulation, and Machine Learning,” Thermal Science and Engineering Progress, vol. 51, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[13] Tao Yang et al., “A Review on Application of Pin-Fins in Enhancing Heat Transfer,” Energies, vol. 17, no. 17, pp. 1-17, 2024.
[Google Scholar] [Publisher Link]
[14] Jie Li et al., “Thermal Performance of Pin Fin Heat Sinks with Phase Change Material for Electronic Devices Thermal Management,” Applied Thermal Engineering, vol. 250, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[15] Naushad Ali et al., “Heat Dissipation and Fluid Flow in Micro-Channel Heat Sink Equipped with Semi-Elliptical Pin-Fin Structures: A Numerical Study,” International Communications in Heat and Mass Transfer, vol. 155, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[16] F.L. Tan, and C.P. Tso, “Cooling of Mobile Electronic Devices Using Phase Change Materials,” Applied Thermal Engineering, vol. 24, no. 2-3, pp. 159-169, 2004.
[CrossRef] [Google Scholar] [Publisher Link]
[17] Dhamyaa S. Khudhur, Reyadh Ch Al-Zuhairy, and Muna S. Kassim, “Thermal Analysis of Heat Transfer with Different Fin Geometry through Straight Plate-Fin Heat Sinks,” International Journal of Thermal Sciences, vol. 174, 2022.
[CrossRef] [Google Scholar] [Publisher Link]
[18] V.C. Midhun, Mayank Maroliya, and Sandip K. Saha, “Numerical Investigation and Optimisation of Solid–Solid Phase Change Material Composite-Based Plate-Fin Heat Sink for Thermal Management of Electronic Package,” Applied Thermal Engineering, vol. 248, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[19] Ozgun Kosdere, Zerrin Sert, and Ozge Altun, “Investigation of Thermal Performance at Forced Convection in Plate-Fin Heat Sink,” Energy, vol. 307, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[20] Kitti Nilpueng, Preecha Kaseethong, and Somchai Wongwises, “Heat Transfer and Flow Characteristics of a Plate-Fin Heat Sink Equipped with Copper Foam and Twisted Tapes,” Heliyon, vol. 10, no. 12, pp. 1-12, 2024. [CrossRef] [Google Scholar] [Publisher Link]
[21] Athasit Wongcharoen et al., “Influence of Pin-Perforation Shape on Thermohydraulic Performance of Circular Pin-Fin Heat Sinks under Turbulent Flow,” Ain Shams Engineering Journal, vol. 15, no. 5, pp. 1-12, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[22] Yousef Alihosseini et al., “Oblique Microchannel Merged with Circle Micro Pin-Fin as a Novel Hybrid Heat Sink for Cooling of Electronic Devices,” Case Studies in Thermal Engineering, vol. 53, pp. 1-15, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[23] Zahid Maqbool, M. Hanief, and Malik Parveez, “Review on Performance Enhancement of Phase Change Material Based Heat Sinks in Conjugation with Thermal Conductivity Enhancers for Electronic Cooling,” Journal of Energy Storage, vol. 60, 2023.
[CrossRef] [Google Scholar] [Publisher Link]
[24] Imran Zahid et al., “Experimental Optimization of Various Heat Sinks Using Passive Thermal Management System,” Case Studies in Thermal Engineering, vol. 49, pp. 1-13, 2023.
[CrossRef] [Google Scholar] [Publisher Link]
[25] Tauseef-ur Rehman, and Cheol Woo Park, “Optimising Heat Sink Performance with Porous Media–PCM Integration: An Experimental Investigation,” Applied Thermal Engineering, vol. 242, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[26] Deepa Gupta, Probir Saha, and Somnath Roy, “Computational Analysis of Perforation Effect on the Thermo-Hydraulic Performance of Micro Pin-Fin Heat Sink,” International Journal of Thermal Sciences, vol. 163, 2021.
[CrossRef] [Google Scholar] [Publisher Link]
[27] Muhammad Anas Wazir et al., “Thermal Enhancement of Microchannel Heat Sink Using Pin-Fin Configurations and Geometric Optimization,” Engineering Research Express, vol. 6, no. 1, pp. 1-25, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[28] Taha Tuna Göksu, “Investigation of Pin and Perforated Heatsink Cooling Efficiency and Temperature Distribution,” Journal of Thermal Analysis and Calorimetry, vol. 149, no. 12, pp. 6517-6529, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[29] Behzad Heidarshenas et al., “Numerical Study and Optimization of Thermal Efficiency for a Pin Fin Heatsink with Nanofluid Flow by Modifying Heatsink Geometry,” Case Studies in Thermal Engineering, vol. 55, pp. 1-18, 2024.
[CrossRef] [Google Scholar] [Publisher Link]
[30] Ahmed Dhafer Abdulsahib, Dhirgham Alkhafaji, and Ibrahim M. Albayati, “Thermal Design and Heat Transfer Analysis of Heat Sinks and Enclosures: A Review,” International Journal of Heat and Technology, vol. 42, no. 4, pp. 1149-1163, 2024. [CrossRef] [Google Scholar] [Publisher Link]
[31] Xiaoling Yu et al., “Development of a Plate-Pin Fin Heat Sink and Its Performance Comparisons with a Plate Fin Heat Sink,” Applied Thermal Engineering, vol. 25, no. 2-3, pp. 173-182, 2005.
[CrossRef] [Google Scholar] [Publisher Link]
[32] H. Shaukatullah et al., “Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications,” IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 19, no. 4, pp. 486-494, 1996.
[CrossRef] [Google Scholar] [Publisher Link]
[33] Maissa Bouguila et al., “Thermal Performances of Finned Heat Sink Filled with Nano-Enhanced Phase Change Materials: Design Optimization and Parametric Study,” International Journal of Heat and Mass Transfer, vol. 202, 2023.
[CrossRef] [Google Scholar] [Publisher Link]
[34] Ahmed Abdulnabi Imran, Nabeel Sameer Mahmoud, and Hayder Mohammad Jaffal, “Numerical and Experimental Investigation of Heat Transfer in Liquid Cooling Serpentine Mini-Channel Heat Sink with Different New Configuration Models,” Thermal Science and Engineering Progress, vol. 6, pp. 128-139, 2018.
[CrossRef] [Google Scholar] [Publisher Link]
[35] Rajesh Baby, and C. Balaji, “Thermal Performance of a PCM Heat Sink under Different Heat Loads: An Experimental Study,” International Journal of Thermal Sciences, vol. 79, pp. 240-249, 2014.
[CrossRef] [Google Scholar] [Publisher Link]
[36] Haluk Anil Kose, Alperen Yildizeli, and Sertac Cadirci, “Parametric Study and Optimization of Microchannel Heat Sinks with Various Shapes,” Applied Thermal Engineering, vol. 211, 2022.
[CrossRef] [Google Scholar] [Publisher Link]
[37] K. Shailesh, Y. Naresh, and J. Banerjee, “Heat Transfer Performance of a Novel PCM Based Heat Sink Coupled with Heat Pipe: An Experimental Study,” Applied Thermal Engineering, vol. 229, 2023.
[CrossRef] [Google Scholar] [Publisher Link]
[38] R. Srikanth, and C. Balaji, “Experimental Investigation on the Heat Transfer Performance of a PCM Based Pin Fin Heat Sink with Discrete Heating,” International Journal of Thermal Sciences, vol. 111, pp. 188-203, 2017.
[CrossRef] [Google Scholar] [Publisher Link]
[39] Reiyu Chein, and Jason Chuang, “Experimental Microchannel Heat Sink Performance Studies Using Nanofluids,” International Journal of Thermal Sciences, vol. 46, no. 1, pp. 57-66, 2007.
[CrossRef] [Google Scholar] [Publisher Link]